X Wire technology now qualified

2008-07-19 14:45:46 (GMT) (Caymanmama.com - Technology News)



Dallas, Texas (CaymanMama.com) — Linear Technology Corporation and a private Canadian Corporation, Microbands Inc., have declared the successful qualification of the Microbands X Wire- TM: 89.29, -0.76, -0.84 % protected wire bonding technology to allow design suppleness for IC packages of the Linear’s Technology.

The worldwide demand for electronics is driving the necessity for superior performance aptitude of the advanced integrated circuits in order to be compressed in small geometric as well as dwindling form factors. Microbands’ X Wire insulated bonding wire technology is completely a nano-scale material penetrate, which addresses various hard interconnect hurdles occurring from the progressively compound single as well as 3D packaging designs of stacked die.

With a span of two years, the Linear Technology performed an inclusive set of consistency and manufacturability testing by using the X Wire TM: 89.29, -0.76, -0.84 % on the high voltage applications through a gold based layered bonding wire. The X Wire TM: 89.29, -0.76, -0.84% cleared all the test criterion, fulfilling the standards of the industry incorporating JEDEC –STD-020C MSL Level 1 and JESD22-A dependability standards. X Wire TM: 89.29, -0.76, -0.84 % also proficiently attained Linear Technology’s inflexible internal functional and electrical test needs.

The Linear Technology is targeting X Wire TM: 89.29, -0.76, -0.84 % in order to be utilized on the number of the product lines to enhance aptitude and decrease product and expansion and the time of the package design cycle, at the time of using the current low rates assembly infrastructure. X Wire Technology will allows users to pack increased chip functionality in customary packages enabling the bonding wires to touch and cross in the 3D space devoid of possibility of the electrical failure.

Greg Peck, the Director of Engineering of the Linear Technology, said this would provide the flexibility to bond chips in such a manner that was not probable earlier.



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